Of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 8517 or parts of automatic data processing
Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron-beam, ionic-beam or plasma arc processes; water-jet cutting machines: > Operated by laser or other light or photon beam processes > Operated by other light or photon beam processes: > Other: > Of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 8517 or parts of automatic data processing
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8456.12.70.00
Laser PCB Drilling Machine
A precision laser machine designed to drill microvias and blind vias in printed circuit boards (PCBs) by removing material through photon beam ablation. It is used solely for PCB manufacturing to create high-density interconnects essential for modern electronics. Classified under HTS 8456.12.70.00 due to its principal use in producing printed circuits.
UV Laser PCB Depaneling System
A UV photon beam system that precisely cuts individual PCBs from production panels by ablating material along scored lines without mechanical stress. Principally used in high-volume printed circuit assembly lines for electronics like smartphones. Falls under HTS 8456.12.70.00 for its dedicated role in printed circuit manufacturing.
Photon Beam PCB Via Ablation Tool
Advanced tool using non-laser photon beams to ablate precise vias in multi-layer PCB substrates for high-speed data processing components. Exclusively for manufacturing parts of automatic data processing machines. HTS 8456.12.70.00 applies due to its specific use in printed circuit production.
Excimer Laser Printed Circuit Etcher
Excimer laser etcher employing ultraviolet photon beams to selectively remove copper layers from PCB laminates during circuit patterning. Used principally for fabricating printed circuit assemblies in server hardware. Classified in HTS 8456.12.70.00 for photon beam material removal in PCB production.
Laser Micro-Machining Station for PCAs
Compact station for laser micro-machining features like cavities and trenches in printed circuit assemblies (PCAs) using other light beams for 5G modules. Solely for high-precision electronics parts under heading 8517. HTS 8456.12.70.00 due to dedicated PCB/PCA application.
Femtosecond Laser PCB Structuring Equipment
Femtosecond photon beam equipment for ultra-precise structuring of PCB surfaces, creating nanostructures for advanced data processing parts. Principally used in semiconductor-adjacent PCB fabrication. Fits HTS 8456.12.70.00 for light beam material removal in printed circuits.
Photon Ablation System for ADP Parts
Industrial system using plasma-enhanced photon beams to ablate material from substrates for automatic data processing (ADP) machine parts like motherboard cores. Exclusively for printed circuit production. HTS 8456.12.70.00 specifies its use for ADP and PCB manufacturing.
UV Laser Singulation Machine for PCBs
Machine for singulating semiconductor packages mounted on PCB carriers using UV laser photon beams for clean, stress-free separation. Used principally in printed circuit assembly for heading 8517 parts. Classified under HTS 8456.12.70.00 for PCB-specific applications.