Laser PCB Drilling Machine from China
A precision laser machine designed to drill microvias and blind vias in printed circuit boards (PCBs) by removing material through photon beam ablation. It is used solely for PCB manufacturing to create high-density interconnects essential for modern electronics. Classified under HTS 8456.12.70.00 due to its principal use in producing printed circuits.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify machine specifications confirm exclusive use for PCB or ADP parts to avoid reclassification; provide end-user certificates from buyers in electronics manufacturing; ensure laser safety certifications comply with FDA and OSHA standards