Salient SPL-4000 UV Laser Micromachining Station
UV nanosecond laser for micromachining ceramics, polymers, and thin films with sub-micron precision via photon-induced ablation. Under HTS 8456.11.90.00 for specialized 'other' laser tools removing material by light beam in R&D and electronics fab.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 2.4% | +35.0% | 37.4% |
| 🇲🇽Mexico | 2.4% | +10.0% | 12.4% |
| 🇨🇦Canada | 2.4% | +10.0% | 12.4% |
| 🇩🇪Germany | 2.4% | +10.0% | 12.4% |
| 🇯🇵Japan | 2.4% | +10.0% | 12.4% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If numerically controlled semiconductor slicer
NC wafer slicing saws with laser assist move to specific semiconductor subheading.
If for retail hand tools
Handheld laser engravers for consumer use classify as machinery for working wood/other.
If primary function is laser welding
Material addition (welding) vs removal (cutting) shifts to laser welding machines.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Provide ablation rate data and material compatibility lists to justify non-wafer classification
• Classify software-embedded controls correctly; embedded PLCs stay with machine, not 8471
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