Salient SPL-4000 UV Laser Micromachining Station from Japan
UV nanosecond laser for micromachining ceramics, polymers, and thin films with sub-micron precision via photon-induced ablation. Under HTS 8456.11.90.00 for specialized 'other' laser tools removing material by light beam in R&D and electronics fab.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide ablation rate data and material compatibility lists to justify non-wafer classification
• Classify software-embedded controls correctly; embedded PLCs stay with machine, not 8471