Trumpf TruLaser 3030 Fiber Laser Cutting Machine
A high-precision fiber laser cutting machine designed for processing sheet metal up to 1 inch thick using a 4kW laser source. It employs photon beam technology to remove material through melting and vaporization, fitting under HTS 8456.11.90.00 as 'other' laser-operated machine tools not specifically enumerated elsewhere. Ideal for industrial fabrication of steel, aluminum, and stainless steel parts.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 2.4% | +35.0% | 37.4% |
| 🇲🇽Mexico | 2.4% | +10.0% | 12.4% |
| 🇨🇦Canada | 2.4% | +10.0% | 12.4% |
| 🇩🇪Germany | 2.4% | +10.0% | 12.4% |
| 🇯🇵Japan | 2.4% | +10.0% | 12.4% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If used for semiconductor wafer preparation
Statistical notes place wafer slicing/grinding equipment in dedicated semiconductor provisions under 8456.10.
If configured as a numerically controlled bending machine with integrated laser
Lasers integral to bending or forming operations shift to Chapter 8462 for machine tools working metal by bending.
If handheld laser marking tool for retail sale
Small-scale lasers for engraving/marking resemble optoelectronic instruments rather than industrial material removal machine tools.
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Import Tips & Compliance
• Verify laser power (e.g
• >500W) and beam type in technical specs to confirm classification under laser processes, not plasma or water-jet
• Include detailed machine manuals and CE/ISO certifications; U.S
• Customs may require proof it's not for semiconductor wafer processing
Related Products under HTS 8456.11.90.00
Coherent ARM Laser Marking and Cutting Platform
Adjustable ring-mode fiber laser for both marking and fine cutting of metals/polymers using variable photon beam profiles. HTS 8456.11.90.00 includes such versatile 'other' laser systems for material removal processes.
Bystronic ByStar Fiber 3015 Laser Cutter
Industrial fiber laser cutter with 12kW power for cutting thick metals like mild steel up to 1.5 inches using high-speed photon beam ablation. Classified under HTS 8456.11.90.00 for 'other' laser machine tools performing material removal by light beam processes in general manufacturing.
Amada FOL3015AJ Pulsed Fiber Laser System
Pulsed fiber laser for precision cutting of thin sheets and non-metals like plastics using short photon bursts for minimal heat-affected zones. Falls under HTS 8456.11.90.00 as an 'other' laser-operated tool for material removal in diverse industrial applications.
Mazak Optiplex Nexus 4020 CO2 Laser Cutter
CO2 laser cutting center for large-format metal sheets up to 4000x2000mm, using gas laser photon beam for thermal material removal. HTS 8456.11.90.00 covers this as 'other' non-fiber, non-semiconductor laser machine tool.
Salient SPL-4000 UV Laser Micromachining Station
UV nanosecond laser for micromachining ceramics, polymers, and thin films with sub-micron precision via photon-induced ablation. Under HTS 8456.11.90.00 for specialized 'other' laser tools removing material by light beam in R&D and electronics fab.
IPG YLR-2000 Fiber Laser Cutting Head Assembly
High-brightness ytterbium fiber laser cutting head for integration into CNC systems, performing material removal via focused 2kW photon beam. Though a component, complete operational units classify under HTS 8456.11.90.00 as 'other' laser machine tools.