Salient SPL-4000 UV Laser Micromachining Station from China
UV nanosecond laser for micromachining ceramics, polymers, and thin films with sub-micron precision via photon-induced ablation. Under HTS 8456.11.90.00 for specialized 'other' laser tools removing material by light beam in R&D and electronics fab.
Duty Rate — China → United States
37.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide ablation rate data and material compatibility lists to justify non-wafer classification
• Classify software-embedded controls correctly; embedded PLCs stay with machine, not 8471