UV Laser PCB Via Drilling System
A high-precision UV laser system drills micro-vias in multilayer printed circuit boards for HDI applications. Classified in HTS 8456.11.70.00 as it is used principally for printed circuit manufacturing through photon beam material removal. Supports blind and buried vias down to 50 microns.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If using electro-discharge instead of laser process
EDM drilling machines for PCBs use electro-discharge rather than photon beam processes.
If imported as complete semiconductor wafer processing equipment
May qualify under semiconductor manufacturing machines if used for wafer-level rather than PCB fabrication.
If for mechanical micro-drilling setups
Non-laser drilling tools for PCBs classified under sawing or cutting machines working metal.
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Import Tips & Compliance
• Provide laser wavelength specs (typically 355nm UV) and throughput data showing PCB-specific optimization
• Declare beam delivery optics and galvo scanners as integral parts; separate import may trigger different classifications
• Avoid common pitfalls by confirming no metalworking capability, which could reclassify under broader laser tool headings
Related Products under HTS 8456.11.70.00
Laser PCB Depaneling Machine
This machine uses a CO2 or fiber laser to precisely cut individual printed circuit boards from production panels without mechanical stress. It is classified under HTS 8456.11.70.00 because it is designed solely for the manufacture of printed circuit assemblies by removing material via laser processes. Ideal for high-volume electronics production.
Fiber Laser PCB Singulation Tool
Compact fiber laser station for singulating flex circuits and rigid-flex PCBs with minimal heat-affected zones. Falls under HTS 8456.11.70.00 due to its principal use in printed circuit assembly production via laser ablation. Features automated vision alignment for precision.
Femtosecond Laser PCB Structuring Machine
Ultrafast femtosecond laser for fine structuring and patterning of PCB copper layers without thermal damage. HTS 8456.11.70.00 classification applies as it's solely for printed circuit fabrication using advanced photon beam technology. Enables sub-micron feature resolution.
CO2 Laser PCB Panel Separator
Industrial CO2 laser for clean separation of high-layer-count PCB panels in volume production. HTS 8456.11.70.00 due to exclusive use in printed circuit manufacturing via laser cutting processes. Handles panels up to 24x24 inches.
Laser Micro-Machining Center for PCBA
Multi-axis laser workstation for trimming, shaping, and fiducial marking on printed circuit assemblies. Specifically designed for heading 8517 parts and ADP units, qualifying for HTS 8456.11.70.00. Integrates with inline SMT production lines.