Femtosecond Laser PCB Structuring Machine
Ultrafast femtosecond laser for fine structuring and patterning of PCB copper layers without thermal damage. HTS 8456.11.70.00 classification applies as it's solely for printed circuit fabrication using advanced photon beam technology. Enables sub-micron feature resolution.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If adapted for semiconductor device testing
Laser systems for semiconductor testing fall under Chapter 90 parts and accessories.
If for plasma arc rather than laser processing
Different energy source changes the process heading classification.
Not sure which classification is right?
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Import Tips & Compliance
• Document pulse duration (<500fs) and ablation threshold data specific to PCB materials like FR4 and copper
• Ensure export control compliance for high-power femtosecond lasers under semiconductor equipment regulations
• Prevent misclassification by excluding any general marking capabilities in technical specs
Related Products under HTS 8456.11.70.00
Laser PCB Depaneling Machine
This machine uses a CO2 or fiber laser to precisely cut individual printed circuit boards from production panels without mechanical stress. It is classified under HTS 8456.11.70.00 because it is designed solely for the manufacture of printed circuit assemblies by removing material via laser processes. Ideal for high-volume electronics production.
UV Laser PCB Via Drilling System
A high-precision UV laser system drills micro-vias in multilayer printed circuit boards for HDI applications. Classified in HTS 8456.11.70.00 as it is used principally for printed circuit manufacturing through photon beam material removal. Supports blind and buried vias down to 50 microns.
Fiber Laser PCB Singulation Tool
Compact fiber laser station for singulating flex circuits and rigid-flex PCBs with minimal heat-affected zones. Falls under HTS 8456.11.70.00 due to its principal use in printed circuit assembly production via laser ablation. Features automated vision alignment for precision.
CO2 Laser PCB Panel Separator
Industrial CO2 laser for clean separation of high-layer-count PCB panels in volume production. HTS 8456.11.70.00 due to exclusive use in printed circuit manufacturing via laser cutting processes. Handles panels up to 24x24 inches.
Laser Micro-Machining Center for PCBA
Multi-axis laser workstation for trimming, shaping, and fiducial marking on printed circuit assemblies. Specifically designed for heading 8517 parts and ADP units, qualifying for HTS 8456.11.70.00. Integrates with inline SMT production lines.