UV Laser PCB Via Drilling System from Japan
A high-precision UV laser system drills micro-vias in multilayer printed circuit boards for HDI applications. Classified in HTS 8456.11.70.00 as it is used principally for printed circuit manufacturing through photon beam material removal. Supports blind and buried vias down to 50 microns.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide laser wavelength specs (typically 355nm UV) and throughput data showing PCB-specific optimization
• Declare beam delivery optics and galvo scanners as integral parts; separate import may trigger different classifications
• Avoid common pitfalls by confirming no metalworking capability, which could reclassify under broader laser tool headings