Wafer Surface Lapper Machine

Machine that laps semiconductor wafers to achieve precise flatness and dimensional tolerances prior to fabrication, per statistical notes under HTS 8451.80.00.00 for wafer preparation. Treated as 'other machinery' similar to textile finishing equipment for surface preparation.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3.5%+35.0%38.5%
🇲🇽Mexico3.5%+10.0%13.5%
🇨🇦Canada3.5%+10.0%13.5%
🇩🇪Germany3.5%+10.0%13.5%
🇯🇵Japan3.5%+10.0%13.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.40Lower: 14.4% vs 38.5%

If optimized for semiconductor wafer polishing/lapping specifically

Dedicated wafer processing explicitly under 8460 in Chapter 84 notes.

8479.89.65Lower: 20.3% vs 38.5%

If for industrial-scale boule lapping pre-slicing

Unspecified semiconductor manufacturing apparatus uses this catch-all.

8204.20.00Higher: 44% vs 38.5%

If imported as interchangeable lapping tools, not full machine

Parts like lapping plates classified as hand tools or accessories.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include flatness tolerance specs (e.g

<1 micron) in import docs for verification

Certify for semiconductor end-use to leverage statistical provisions