Wafer Surface Lapper Machine from Germany
Machine that laps semiconductor wafers to achieve precise flatness and dimensional tolerances prior to fabrication, per statistical notes under HTS 8451.80.00.00 for wafer preparation. Treated as 'other machinery' similar to textile finishing equipment for surface preparation.
Duty Rate — Germany → United States
13.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include flatness tolerance specs (e.g
• <1 micron) in import docs for verification
• Certify for semiconductor end-use to leverage statistical provisions