Wafer Surface Lapper Machine from Japan
Machine that laps semiconductor wafers to achieve precise flatness and dimensional tolerances prior to fabrication, per statistical notes under HTS 8451.80.00.00 for wafer preparation. Treated as 'other machinery' similar to textile finishing equipment for surface preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include flatness tolerance specs (e.g
• <1 micron) in import docs for verification
• Certify for semiconductor end-use to leverage statistical provisions