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8451.80.00.00/Wafer Surface Lapper Machine/Canada

Wafer Surface Lapper Machine from Canada

Machine that laps semiconductor wafers to achieve precise flatness and dimensional tolerances prior to fabrication, per statistical notes under HTS 8451.80.00.00 for wafer preparation. Treated as 'other machinery' similar to textile finishing equipment for surface preparation.

Duty Rate — Canada → United States

13.5%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Include flatness tolerance specs (e.g

• <1 micron) in import docs for verification

• Certify for semiconductor end-use to leverage statistical provisions

Wafer Surface Lapper Machine from Canada — Import Duty Rate | HTS 8451.80.00.00