Wafer Slicing Diamond Wire Guide
Precision ceramic or carbide guide roller for diamond wire saws (8426.19) that slice silicon boules into thin wafers during semiconductor preparation. It qualifies for 8431.49.1010 due to its sole use in machinery of subheadings 8426.11, 8426.19.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If considered interchangeable tooling rather than dedicated machine part
Interchangeable tools for multiple saw types classify as base metal tools under 8207, not machinery parts.
If predominantly ceramic construction sold separately
Ceramic articles of a kind used in machinery but not principal parts go to Chapter 69.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include OEM part numbers and machine model compatibility to prove principal use
• Ensure HTS declaration matches subheading 8426.19 for wire saws specifically
Related Products under HTS 8431.49.10.10
Crystal Puller Seed Holder Chuck
Rotating graphite or molybdenum chuck that precisely grips silicon seed crystal during Czochralski pulling in 8426.11 pullers. Critical growth interface part for 8431.49.1010.
Float Zone Crystal Grower RF Coil
Radio frequency induction coil for float zone crystal growers (8426.11) that melts silicon rods without crucibles to produce high-purity monocrystalline ingots for wafers. Classified in 8431.49.1010 as a principal part dedicated to semiconductor processing equipment.
Wafer Lapping Machine Conditioning Ring
Cast iron or composite conditioning ring for wafer lappers (8426.30) that dresses the lapping plate surface for flatness control in semiconductor wafer preparation. Specific to machinery in 8426.11/19/30 subheadings, hence 8431.49.1010.
Crystal Grinder Flattening Fixture
Custom precision fixture that holds crystal boules for grinding orientation flats indicating conductivity type in 8426.30 equipment. Semiconductor-specific part for 8431.49.1010 classification.
Wafer Polishing Pad Conditioner Disk
Diamond-embedded conditioner disk for dressing chemical mechanical polishing pads on wafer polishers (8426.30). Essential maintenance part solely for semiconductor wafer finishing machinery under 8431.49.1010.
Float Zone Furnace Quartz Crucible Holder
Although float zone is crucible-less, this precision quartz holder supports seed/feed rods in RF furnaces (8426.11) for stable zone melting. Part for semiconductor crystal growth equipment under 8431.49.1010.