Wafer Slicing Diamond Wire Guide from Canada
Precision ceramic or carbide guide roller for diamond wire saws (8426.19) that slice silicon boules into thin wafers during semiconductor preparation. It qualifies for 8431.49.1010 due to its sole use in machinery of subheadings 8426.11, 8426.19.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include OEM part numbers and machine model compatibility to prove principal use
• Ensure HTS declaration matches subheading 8426.19 for wire saws specifically