Of machinery of subheadings 8426.11, 8426.19 and 8426.30
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430: > Of machinery of heading 8426, 8429 or 8430: > Other: > Of machinery of heading 8426 > Of machinery of subheadings 8426.11, 8426.19 and 8426.30
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8431.49.10.10
Crystal Puller Seed Holder Chuck
Rotating graphite or molybdenum chuck that precisely grips silicon seed crystal during Czochralski pulling in 8426.11 pullers. Critical growth interface part for 8431.49.1010.
Float Zone Crystal Grower RF Coil
Radio frequency induction coil for float zone crystal growers (8426.11) that melts silicon rods without crucibles to produce high-purity monocrystalline ingots for wafers. Classified in 8431.49.1010 as a principal part dedicated to semiconductor processing equipment.
Wafer Lapping Machine Conditioning Ring
Cast iron or composite conditioning ring for wafer lappers (8426.30) that dresses the lapping plate surface for flatness control in semiconductor wafer preparation. Specific to machinery in 8426.11/19/30 subheadings, hence 8431.49.1010.
Crystal Grinder Flattening Fixture
Custom precision fixture that holds crystal boules for grinding orientation flats indicating conductivity type in 8426.30 equipment. Semiconductor-specific part for 8431.49.1010 classification.
Wafer Polishing Pad Conditioner Disk
Diamond-embedded conditioner disk for dressing chemical mechanical polishing pads on wafer polishers (8426.30). Essential maintenance part solely for semiconductor wafer finishing machinery under 8431.49.1010.
Float Zone Furnace Quartz Crucible Holder
Although float zone is crucible-less, this precision quartz holder supports seed/feed rods in RF furnaces (8426.11) for stable zone melting. Part for semiconductor crystal growth equipment under 8431.49.1010.
Diamond Wire Saw Tensioner Roller
Ceramic-coated tensioning roller maintaining diamond wire tension and alignment in wafer slicing saws (8426.19). Dedicated semiconductor equipment part under 8431.49.1010.
boule Slicing Coolant Manifold
Stainless steel manifold distributing coolant to diamond wire during silicon boule slicing on 8426.19 saws. Fluid distribution part specific to semiconductor wafer prep machinery for 8431.49.1010.
Wafer Polisher Head Retaining Ring
Consumable composite retaining ring that holds wafer in place against polishing pad during CMP on 8426.30 polishers. Classified as principal wearing part for 8431.49.1010.
Czochralski Crystal Puller Heater Element
A graphite or molybdenum heater element designed specifically for use in Czochralski crystal pullers under HTS 8426.11, used to melt polysilicon for growing monocrystalline silicon boules. It falls under 8431.49.1010 as a part solely for semiconductor wafer manufacturing machinery of subheading 8426.11.
Wafer Slicing Diamond Wire Guide
Precision ceramic or carbide guide roller for diamond wire saws (8426.19) that slice silicon boules into thin wafers during semiconductor preparation. It qualifies for 8431.49.1010 due to its sole use in machinery of subheadings 8426.11, 8426.19.
Crystal Boule Grinder Spindle Assembly
High-precision spindle with diamond-impregnated quill for crystal grinders (8426.30) that shape silicon boules to exact wafer diameters and flats indicating resistivity. Falls under 8431.49.1010 as part for semiconductor-specific grinding machinery.
Semiconductor Wafer Polisher Slurry Nozzle
Sapphire or silicon carbide nozzle assembly for delivering polishing slurry precisely onto wafer polishers (8426.30) in semiconductor fabs. Classified under 8431.49.1010 for its principal use in designated subheading machinery.
Wire Saw Slurry Recirculation Pump Impeller
Tungsten carbide impeller for recirculation pumps in diamond wire wafer slicing saws (8426.19), handling abrasive silicon slurry. Exclusive for semiconductor machinery parts under 8431.49.1010.
Wafer Grinder Vacuum Chuck
Porous ceramic vacuum chuck that holds semiconductor wafers during back grinding to ultra-thin dimensions on 8426.30 grinders. Principal part for listed machinery subheadings qualifying for 8431.49.1010.