Semiconductor Wafer Polisher Slurry Nozzle

Sapphire or silicon carbide nozzle assembly for delivering polishing slurry precisely onto wafer polishers (8426.30) in semiconductor fabs. Classified under 8431.49.1010 for its principal use in designated subheading machinery.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8424.90.90Same rate: 35%

If configured as mechanical atomizer/spray appliance

Spray nozzles functioning independently classify under 8424 mechanical appliances.

6903.20.00.00Same rate: 35%

If refractory ceramic nozzle sold without assembly

Containing silicon carbide ceramic products go to Chapter 69 if not assembled parts.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide flow rate specs and mounting diagrams proving polisher integration

Certify material purity for cleanroom compatibility in import declaration

Related Products under HTS 8431.49.10.10

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Rotating graphite or molybdenum chuck that precisely grips silicon seed crystal during Czochralski pulling in 8426.11 pullers. Critical growth interface part for 8431.49.1010.

Float Zone Crystal Grower RF Coil

Radio frequency induction coil for float zone crystal growers (8426.11) that melts silicon rods without crucibles to produce high-purity monocrystalline ingots for wafers. Classified in 8431.49.1010 as a principal part dedicated to semiconductor processing equipment.

Wafer Lapping Machine Conditioning Ring

Cast iron or composite conditioning ring for wafer lappers (8426.30) that dresses the lapping plate surface for flatness control in semiconductor wafer preparation. Specific to machinery in 8426.11/19/30 subheadings, hence 8431.49.1010.

Crystal Grinder Flattening Fixture

Custom precision fixture that holds crystal boules for grinding orientation flats indicating conductivity type in 8426.30 equipment. Semiconductor-specific part for 8431.49.1010 classification.

Wafer Polishing Pad Conditioner Disk

Diamond-embedded conditioner disk for dressing chemical mechanical polishing pads on wafer polishers (8426.30). Essential maintenance part solely for semiconductor wafer finishing machinery under 8431.49.1010.

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