Semiconductor Wafer Polisher Slurry Nozzle from Germany
Sapphire or silicon carbide nozzle assembly for delivering polishing slurry precisely onto wafer polishers (8426.30) in semiconductor fabs. Classified under 8431.49.1010 for its principal use in designated subheading machinery.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide flow rate specs and mounting diagrams proving polisher integration
• Certify material purity for cleanroom compatibility in import declaration