Semiconductor Wafer Polisher Slurry Nozzle from Germany
Sapphire or silicon carbide nozzle assembly for delivering polishing slurry precisely onto wafer polishers (8426.30) in semiconductor fabs. Classified under 8431.49.1010 for its principal use in designated subheading machinery.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide flow rate specs and mounting diagrams proving polisher integration
• Certify material purity for cleanroom compatibility in import declaration