Wafer Slicing Diamond Wire Guide from Germany
Precision ceramic or carbide guide roller for diamond wire saws (8426.19) that slice silicon boules into thin wafers during semiconductor preparation. It qualifies for 8431.49.1010 due to its sole use in machinery of subheadings 8426.11, 8426.19.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include OEM part numbers and machine model compatibility to prove principal use
• Ensure HTS declaration matches subheading 8426.19 for wire saws specifically