Underfill Dispensing Sprayer for BGA Printed Circuit Packages

Precision jetting system for spraying capillary underfill materials beneath BGA chips on printed circuit boards, preventing delamination during reflow. Mechanical projecting appliance designed principally for advanced PCB assembly. Classified in HTS 8424.89.10.00 per chapter notes for printed circuit manufacture.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8479.89Lower: 12.5% vs 35%

If configured for semiconductor die attach rather than board-level

Equipment principally for semiconductor device assembly per statistical notes.

8424.30.90Same rate: 35%

If for steam or sand blasting of circuit boards

Jet projecting machines using abrasives classified separately.

8413.91.90Same rate: 35%

If imported as pump components of larger dispensing systems

Parts of liquid pumps handled under chapter 84 pump provisions.

Not sure which classification is right?

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Import Tips & Compliance

Include dot jetting pattern specifications and standoff height controls in technical data sheets

End-user affidavits from electronics manufacturers validate principal PCB application

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