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8424.89.10.00/Underfill Dispensing Sprayer for BGA Printed Circuit Packages/Japan

Underfill Dispensing Sprayer for BGA Printed Circuit Packages from Japan

Precision jetting system for spraying capillary underfill materials beneath BGA chips on printed circuit boards, preventing delamination during reflow. Mechanical projecting appliance designed principally for advanced PCB assembly. Classified in HTS 8424.89.10.00 per chapter notes for printed circuit manufacture.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include dot jetting pattern specifications and standoff height controls in technical data sheets

• End-user affidavits from electronics manufacturers validate principal PCB application

Underfill Dispensing Sprayer for BGA Printed Circuit Packages from Japan — Import Duty Rate | HTS 8424.89.10.00