Underfill Dispensing Sprayer for BGA Printed Circuit Packages from Germany
Precision jetting system for spraying capillary underfill materials beneath BGA chips on printed circuit boards, preventing delamination during reflow. Mechanical projecting appliance designed principally for advanced PCB assembly. Classified in HTS 8424.89.10.00 per chapter notes for printed circuit manufacture.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include dot jetting pattern specifications and standoff height controls in technical data sheets
• End-user affidavits from electronics manufacturers validate principal PCB application