Underfill Dispensing Sprayer for BGA Printed Circuit Packages from China
Precision jetting system for spraying capillary underfill materials beneath BGA chips on printed circuit boards, preventing delamination during reflow. Mechanical projecting appliance designed principally for advanced PCB assembly. Classified in HTS 8424.89.10.00 per chapter notes for printed circuit manufacture.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include dot jetting pattern specifications and standoff height controls in technical data sheets
• End-user affidavits from electronics manufacturers validate principal PCB application