Semiconductor Dicing Tape Calender
High-precision calender manufactures UV-release dicing tapes for protecting wafer surfaces during diamond saw cutting. Under 8420.10.9080 for plastic tape calendering dedicated to semiconductor dicing processes. Achieves thickness uniformity <1 micron.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If other self-adhesive tape plates
Finished dicing tapes with adhesive classify in Chapter 39.
If parts of tape machinery
Dicing tape machine components fall under plastics machinery parts.
If precision calender cylinders only
Individual cylinders for dicing tape classify as machine parts.
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Import Tips & Compliance
• Document UV-release properties and dicing tape tolerances; specify wafer diameter compatibility
• Include cleanroom production certification
• Avoid adhesive tape Chapter 39 classification
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