Semiconductor Dicing Tape Calender from Mexico
High-precision calender manufactures UV-release dicing tapes for protecting wafer surfaces during diamond saw cutting. Under 8420.10.9080 for plastic tape calendering dedicated to semiconductor dicing processes. Achieves thickness uniformity <1 micron.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document UV-release properties and dicing tape tolerances; specify wafer diameter compatibility
• Include cleanroom production certification
• Avoid adhesive tape Chapter 39 classification