Other

Calendering or other rolling machines, other than for metals or glass, and cylinders therefor; parts thereof: > Calendering or other rolling machines: > Other > Other

Duty Rate (from China)

35%
MFN Base RateFree

Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Total Effective Rate35%

Products classified under HTS 8420.10.90.80

Silicone Rubber Calendering Machine

This machine calenders uncured silicone rubber sheets to precise thickness for use in semiconductor cleanroom gaskets and seals. It falls under HTS 8420.10.9080 as a calendering machine for non-metallic, non-glass materials like rubber essential in semiconductor processing environments. The heated rollers ensure uniform calendering without contamination.

Semiconductor Photoresist Film Rolling Calender

Specialized calender applies photoresist coating to thin polyester films used in semiconductor photolithography masking. Classified in 8420.10.9080 for rolling/calendering operations on plastic films for semiconductor fabrication. Ensures defect-free coating uniformity critical for wafer patterning.

Cleanroom Polyimide Film Calendering Machine

Calenders polyimide films to micron-level thickness for flexible circuit substrates in semiconductor packaging. HTS 8420.10.9080 covers plastic film calendering machines used in advanced semiconductor substrate production. Provides dust-free rolling essential for high-reliability circuits.

Semiconductor Wafer Backgrind Tape Calender

Produces ultra-thin adhesive tape used for temporary wafer protection during backgrinding in semiconductor thinning processes. Falls under 8420.10.9080 for calendering plastic tape materials serving semiconductor manufacturing. Ensures tape thickness uniformity critical for wafer planarity.

EPDM Rubber Roller Coating Calender for Semiconductor

Calendering machine applies uniform EPDM rubber coating to rollers used in semiconductor wafer handling equipment. HTS 8420.10.9080 classification for rubber calendering serving semiconductor cleanroom applications. Provides contamination-free roller surfaces essential for wafer transport.

Precision PVC Masking Film Rolling Machine

Calenders thin PVC films used as protective masking during semiconductor wafer dicing and packaging. Under 8420.10.9080 for plastic film rolling machines dedicated to semiconductor masking applications. Achieves sub-micron thickness control for clean removal.

Silicon Wafer Protective Film Calendering Line

Multi-roll calender produces protective films applied to silicon wafers during shipping and handling in semiconductor supply chain. HTS 8420.10.9080 covers plastic protective film calendering for semiconductor wafer protection. Ensures bubble-free application and clean removal.

FEP Teflon Calender for Semiconductor Rollers

Calenders FEP Teflon sheets for chemical-resistant rollers in semiconductor wet processing equipment. Classified 8420.10.9080 for fluoropolymer calendering serving semiconductor cleanroom chemical handling. Provides non-stick, contamination-free surfaces.

Cleanroom Conveyor Belt Calendering Machine

Produces static dissipative conveyor belts for semiconductor wafer transport systems using specialized rubber compounds. HTS 8420.10.9080 for rubber calendering machines serving cleanroom conveyor applications. Ensures particle-free belt surfaces.

Semiconductor Dicing Tape Calender

High-precision calender manufactures UV-release dicing tapes for protecting wafer surfaces during diamond saw cutting. Under 8420.10.9080 for plastic tape calendering dedicated to semiconductor dicing processes. Achieves thickness uniformity <1 micron.