Semiconductor Dicing Tape Calender from Japan
High-precision calender manufactures UV-release dicing tapes for protecting wafer surfaces during diamond saw cutting. Under 8420.10.9080 for plastic tape calendering dedicated to semiconductor dicing processes. Achieves thickness uniformity <1 micron.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document UV-release properties and dicing tape tolerances; specify wafer diameter compatibility
• Include cleanroom production certification
• Avoid adhesive tape Chapter 39 classification