Semiconductor Dicing Tape Calender from Japan
High-precision calender manufactures UV-release dicing tapes for protecting wafer surfaces during diamond saw cutting. Under 8420.10.9080 for plastic tape calendering dedicated to semiconductor dicing processes. Achieves thickness uniformity <1 micron.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document UV-release properties and dicing tape tolerances; specify wafer diameter compatibility
• Include cleanroom production certification
• Avoid adhesive tape Chapter 39 classification