Semiconductor Wafer Polisher Compressor

Compressor unit for chemical mechanical planarization (CMP) polishers that deliver process gases to semiconductor wafer surfaces for mirror finish. HTS 8414.80.20 for other compressors in wafer preparation per Chapter 84 statistical notes. Essential for achieving nanoscale flatness before device fabrication.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
๐Ÿ‡จ๐Ÿ‡ณChinaFree+35.0%35%
๐Ÿ‡ฒ๐Ÿ‡ฝMexicoFree+10.0%10%
๐Ÿ‡จ๐Ÿ‡ฆCanadaFree+10.0%10%
๐Ÿ‡ฉ๐Ÿ‡ชGermanyFree+10.0%10%
๐Ÿ‡ฏ๐Ÿ‡ตJapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8424.90.90Same rate: 35%

If parts of mechanical appliances for projecting/ spraying

Slurry delivery systems may classify differently if seen as sprayers rather than compressors.

8479.89.65Lower: 20.3% vs 35%

If part of complete CMP polishing machine

Assembled semiconductor wafer processing machines take precedence over components.

8419.20.00Lower: 10% vs 35%

If medical or dental use adaptation

If repurposed for medical device polishing, shifts to medical equipment provisions.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

โ€ข Include CMP slurry pressure specs and wafer size compatibility (300mm+); reference statistical note (c) for polishers

โ€ข Avoid misclassification by excluding Chapter 90 optical testing equipment

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