Semiconductor Wafer Polisher Compressor from China
Compressor unit for chemical mechanical planarization (CMP) polishers that deliver process gases to semiconductor wafer surfaces for mirror finish. HTS 8414.80.20 for other compressors in wafer preparation per Chapter 84 statistical notes. Essential for achieving nanoscale flatness before device fabrication.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include CMP slurry pressure specs and wafer size compatibility (300mm+); reference statistical note (c) for polishers
• Avoid misclassification by excluding Chapter 90 optical testing equipment