Semiconductor Wafer Polisher Compressor from Japan
Compressor unit for chemical mechanical planarization (CMP) polishers that deliver process gases to semiconductor wafer surfaces for mirror finish. HTS 8414.80.20 for other compressors in wafer preparation per Chapter 84 statistical notes. Essential for achieving nanoscale flatness before device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include CMP slurry pressure specs and wafer size compatibility (300mm+); reference statistical note (c) for polishers
• Avoid misclassification by excluding Chapter 90 optical testing equipment