Wafer Lapping Coolant Circulation Pump

Circulation pump for coolant in wafer lappers achieving flatness tolerances for semiconductor fabrication. HTS 8413.81.0040 as other pump in wafer preparation apparatus. Removes heat and debris during lapping for mirror-surface wafers.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8413.81.00Same rate: 35%

If standard industrial circulation without semiconductor spec

Non-specialized other pumps use different statistical breaks.

9031.80.80Same rate: 35%

If integrated in measuring lapping equipment

Some wafer flatness testers include pumps under measuring machines.

8481.80.90Higher: 37% vs 35%

If as replacement pump components

Separate pump parts for semiconductor equipment classified here.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide lapping process flow diagrams; ensure pumps meet vibration specs for precision tools

Pitfall: incorrect declaration as HVAC pumps

Related Products under HTS 8413.81.00.40

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A high-precision liquid pump used in Czochralski crystal growers to control the flow of molten silicon during monocrystalline boule production for semiconductor wafers. It falls under HTS 8413.81.0040 as an other pump specifically for semiconductor manufacturing equipment. This pump maintains stable melt levels critical for defect-free crystal growth.

Float Zone Melting Process Pump

Specialized pump for circulating inert gases or cooling liquids in float zone crystal growth systems producing high-purity silicon boules for wafers. Classified in HTS 8413.81.0040 as other pumps integral to semiconductor wafer manufacturing equipment. Ensures thermal stability during zone refining process.

Wafer Slicing Coolant Pump

Liquid pump delivering coolant to diamond wire saws during wafer slicing from silicon boules in semiconductor fabrication. HTS 8413.81.0040 covers this as other pumps for wafer preparation equipment. Maintains blade temperature for precise, thin wafer cuts without thermal damage.

Crystal Boule Grinder Slurry Pump

Abrasive slurry pump for crystal grinders shaping silicon boules to exact wafer diameters and flats indicating conductivity. Under HTS 8413.81.0040 for pumps in semiconductor wafer prep equipment. Provides consistent slurry flow for precision grinding.

Wafer Polishing Slurry Feed Pump

Precision metering pump feeding chemical slurry to polishers preparing wafer surfaces for device fabrication. Classified HTS 8413.81.0040 for semiconductor wafer processing pumps. Delivers uniform slurry for sub-micron surface flatness.

Semiconductor Wafer Cleaning Rinse Pump

High-purity DI water pump for post-polish wafer rinsing stations in wafer prep lines. HTS 8413.81.0040 covers pumps for semiconductor wafer preparation equipment. Ensures particle-free surfaces before fabrication.