Crystal Boule Grinder Slurry Pump

Abrasive slurry pump for crystal grinders shaping silicon boules to exact wafer diameters and flats indicating conductivity. Under HTS 8413.81.0040 for pumps in semiconductor wafer prep equipment. Provides consistent slurry flow for precision grinding.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8413.60.00Same rate: 35%

If rotary positive displacement type

Specific pump types like rotary have dedicated subheadings over general other pumps.

8479.82.00Same rate: 35%

If part of automated boule grinding station

Complete semiconductor processing machines include slurry handling systems.

8421.39.01Same rate: 35%

If for high-pressure abrasive slurry delivery

Specialized high-pressure pumps classified separately.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Specify slurry composition in invoices for material handling compliance; test for corrosion resistance certifications

Avoid grouping with general machining pumps

Related Products under HTS 8413.81.00.40

Czochralski Crystal Puller Pump

A high-precision liquid pump used in Czochralski crystal growers to control the flow of molten silicon during monocrystalline boule production for semiconductor wafers. It falls under HTS 8413.81.0040 as an other pump specifically for semiconductor manufacturing equipment. This pump maintains stable melt levels critical for defect-free crystal growth.

Float Zone Melting Process Pump

Specialized pump for circulating inert gases or cooling liquids in float zone crystal growth systems producing high-purity silicon boules for wafers. Classified in HTS 8413.81.0040 as other pumps integral to semiconductor wafer manufacturing equipment. Ensures thermal stability during zone refining process.

Wafer Slicing Coolant Pump

Liquid pump delivering coolant to diamond wire saws during wafer slicing from silicon boules in semiconductor fabrication. HTS 8413.81.0040 covers this as other pumps for wafer preparation equipment. Maintains blade temperature for precise, thin wafer cuts without thermal damage.

Wafer Lapping Coolant Circulation Pump

Circulation pump for coolant in wafer lappers achieving flatness tolerances for semiconductor fabrication. HTS 8413.81.0040 as other pump in wafer preparation apparatus. Removes heat and debris during lapping for mirror-surface wafers.

Wafer Polishing Slurry Feed Pump

Precision metering pump feeding chemical slurry to polishers preparing wafer surfaces for device fabrication. Classified HTS 8413.81.0040 for semiconductor wafer processing pumps. Delivers uniform slurry for sub-micron surface flatness.

Semiconductor Wafer Cleaning Rinse Pump

High-purity DI water pump for post-polish wafer rinsing stations in wafer prep lines. HTS 8413.81.0040 covers pumps for semiconductor wafer preparation equipment. Ensures particle-free surfaces before fabrication.