Refined Copper Laminate Foil with Polyimide Backing
High-temperature refined copper foil backed with polyimide film, thickness ≤0.15mm excluding backing, used in PCB manufacturing for aerospace applications. Falls under HTS 7410.21.60.00 as 'other' backed refined copper foil. The polyimide backing enables thermal stability during lamination processes.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If thickness exceeds 0.15 mm (excluding backing)
Thicker copper foil, regardless of backing, moves to the next thickness category in the same heading.
If the plastic backing dominates and copper is secondary
Primarily plastic sheets/plates with metal coating shift to Chapter 39 if copper doesn't predominate.
If further processed into articles like strips or profiles
Finished copper products beyond basic foil forms are classified in 7419 as other articles of copper.
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Import Tips & Compliance
• Include detailed specs on backing type and copper thickness in commercial invoice to comply with subheading requirements
• Obtain supplier certifications confirming refined copper alloy composition per Chapter 74 notes
Related Products under HTS 7410.21.60.00
Refined Copper Foil Backed with PET Plastic
Thin refined copper foil (under 0.15 mm thick, excluding backing) backed with polyethylene terephthalate (PET) plastic for use in flexible printed circuits and electronics. Classified under HTS 7410.21.60.00 as 'other' backed copper foil of refined copper, distinct from unbacked or paper-backed variants. The plastic backing provides insulation and handling protection.
Adhesive-Backed Refined Copper Foil Tape
Refined copper foil (≤0.15mm thick excl. backing) with pressure-sensitive adhesive plastic backing, used for EMI shielding in consumer electronics. HTS 7410.21.60.00 covers this as 'other' backed refined copper foil. The adhesive backing facilitates easy application in assembly lines.
Refined Copper Foil with Polycarbonate Backing
Ultra-thin refined copper foil backed with polycarbonate sheet (thickness excl. backing ≤0.15mm), for flexible displays and touchscreens. Classified in HTS 7410.21.60.00 as other backed foil of refined copper. Polycarbonate provides rigidity and dielectric properties.
Thermal Transfer Refined Copper Foil with Mylar Backing
Refined copper foil (≤0.15mm excl. backing) with Mylar (biaxially-oriented PET) backing for thermal transfer printing in electronics prototyping. HTS 7410.21.60.00 as other backed refined copper foil. Mylar ensures smooth release during transfer processes.
EMI Shielding Refined Copper Foil with Acrylic Backing
Refined copper foil backed with acrylic polymer film (≤0.15mm copper thickness), designed for electromagnetic interference shielding in smartphones. Under HTS 7410.21.60.00 for other backed refined copper foil. Acrylic backing adds conformability for device integration.
Refined Copper Foil with Kapton Polyimide Backing
High-reliability refined copper foil with Kapton polyimide backing (copper ≤0.15mm thick), for harsh-environment PCBs in automotive ECUs. HTS 7410.21.60.00 covers other backed refined copper foil. Kapton offers superior heat and chemical resistance.