Refined Copper Laminate Foil with Polyimide Backing from China
High-temperature refined copper foil backed with polyimide film, thickness ≤0.15mm excluding backing, used in PCB manufacturing for aerospace applications. Falls under HTS 7410.21.60.00 as 'other' backed refined copper foil. The polyimide backing enables thermal stability during lamination processes.
Duty Rate — China → United States
36.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Include detailed specs on backing type and copper thickness in commercial invoice to comply with subheading requirements
• Obtain supplier certifications confirming refined copper alloy composition per Chapter 74 notes