Refined Copper Laminate Foil with Polyimide Backing from China
High-temperature refined copper foil backed with polyimide film, thickness ≤0.15mm excluding backing, used in PCB manufacturing for aerospace applications. Falls under HTS 7410.21.60.00 as 'other' backed refined copper foil. The polyimide backing enables thermal stability during lamination processes.
Duty Rate — China → United States
76.5%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include detailed specs on backing type and copper thickness in commercial invoice to comply with subheading requirements
• Obtain supplier certifications confirming refined copper alloy composition per Chapter 74 notes