Other
Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0.15 mm: > Backed: > Of refined copper: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 7410.21.60.00
Refined Copper Foil Backed with PET Plastic
Thin refined copper foil (under 0.15 mm thick, excluding backing) backed with polyethylene terephthalate (PET) plastic for use in flexible printed circuits and electronics. Classified under HTS 7410.21.60.00 as 'other' backed copper foil of refined copper, distinct from unbacked or paper-backed variants. The plastic backing provides insulation and handling protection.
Refined Copper Laminate Foil with Polyimide Backing
High-temperature refined copper foil backed with polyimide film, thickness ≤0.15mm excluding backing, used in PCB manufacturing for aerospace applications. Falls under HTS 7410.21.60.00 as 'other' backed refined copper foil. The polyimide backing enables thermal stability during lamination processes.
Adhesive-Backed Refined Copper Foil Tape
Refined copper foil (≤0.15mm thick excl. backing) with pressure-sensitive adhesive plastic backing, used for EMI shielding in consumer electronics. HTS 7410.21.60.00 covers this as 'other' backed refined copper foil. The adhesive backing facilitates easy application in assembly lines.
Refined Copper Foil with Polycarbonate Backing
Ultra-thin refined copper foil backed with polycarbonate sheet (thickness excl. backing ≤0.15mm), for flexible displays and touchscreens. Classified in HTS 7410.21.60.00 as other backed foil of refined copper. Polycarbonate provides rigidity and dielectric properties.
Thermal Transfer Refined Copper Foil with Mylar Backing
Refined copper foil (≤0.15mm excl. backing) with Mylar (biaxially-oriented PET) backing for thermal transfer printing in electronics prototyping. HTS 7410.21.60.00 as other backed refined copper foil. Mylar ensures smooth release during transfer processes.
EMI Shielding Refined Copper Foil with Acrylic Backing
Refined copper foil backed with acrylic polymer film (≤0.15mm copper thickness), designed for electromagnetic interference shielding in smartphones. Under HTS 7410.21.60.00 for other backed refined copper foil. Acrylic backing adds conformability for device integration.
Refined Copper Foil with Kapton Polyimide Backing
High-reliability refined copper foil with Kapton polyimide backing (copper ≤0.15mm thick), for harsh-environment PCBs in automotive ECUs. HTS 7410.21.60.00 covers other backed refined copper foil. Kapton offers superior heat and chemical resistance.