Refined Copper Foil Backed with PET Plastic
Thin refined copper foil (under 0.15 mm thick, excluding backing) backed with polyethylene terephthalate (PET) plastic for use in flexible printed circuits and electronics. Classified under HTS 7410.21.60.00 as 'other' backed copper foil of refined copper, distinct from unbacked or paper-backed variants. The plastic backing provides insulation and handling protection.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If not backed with any material
Unbacked copper foil, even if printed, falls under of a kind used for printed circuits without backing.
If backed specifically with paper or paperboard
Paper-backed copper foil has its own subheading, separating it from plastic or similar backings.
If pre-printed with conductive pattern and imported as finished flexible circuit
Assembled or insulated wire/cable products incorporating the foil are classified by function in Chapter 85.
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Import Tips & Compliance
• Verify copper purity meets 'refined copper' standards (≥99.85% Cu) with mill test certificates to avoid reclassification
• Measure thickness excluding backing precisely; provide lab reports if audited, as exceeding 0.15mm shifts to 7410.22
• Declare backing material accurately on entry docs to prevent penalties for misdescription
Related Products under HTS 7410.21.60.00
Refined Copper Laminate Foil with Polyimide Backing
High-temperature refined copper foil backed with polyimide film, thickness ≤0.15mm excluding backing, used in PCB manufacturing for aerospace applications. Falls under HTS 7410.21.60.00 as 'other' backed refined copper foil. The polyimide backing enables thermal stability during lamination processes.
Adhesive-Backed Refined Copper Foil Tape
Refined copper foil (≤0.15mm thick excl. backing) with pressure-sensitive adhesive plastic backing, used for EMI shielding in consumer electronics. HTS 7410.21.60.00 covers this as 'other' backed refined copper foil. The adhesive backing facilitates easy application in assembly lines.
Refined Copper Foil with Polycarbonate Backing
Ultra-thin refined copper foil backed with polycarbonate sheet (thickness excl. backing ≤0.15mm), for flexible displays and touchscreens. Classified in HTS 7410.21.60.00 as other backed foil of refined copper. Polycarbonate provides rigidity and dielectric properties.
Thermal Transfer Refined Copper Foil with Mylar Backing
Refined copper foil (≤0.15mm excl. backing) with Mylar (biaxially-oriented PET) backing for thermal transfer printing in electronics prototyping. HTS 7410.21.60.00 as other backed refined copper foil. Mylar ensures smooth release during transfer processes.
EMI Shielding Refined Copper Foil with Acrylic Backing
Refined copper foil backed with acrylic polymer film (≤0.15mm copper thickness), designed for electromagnetic interference shielding in smartphones. Under HTS 7410.21.60.00 for other backed refined copper foil. Acrylic backing adds conformability for device integration.
Refined Copper Foil with Kapton Polyimide Backing
High-reliability refined copper foil with Kapton polyimide backing (copper ≤0.15mm thick), for harsh-environment PCBs in automotive ECUs. HTS 7410.21.60.00 covers other backed refined copper foil. Kapton offers superior heat and chemical resistance.