Precision Diamond Grinding Disc

Ultra-thin disc of agglomerated natural diamond for grinding thin wafers in electronics production. HTS 6804.21.00 due to diamond composition for semiconductor polishing/cutting. Enables sub-micron flatness tolerances.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

2842.10.00.00Higher: 38.7% vs 35%

If supplied as loose/suspended diamond powder

Unagglomerated synthetic diamond powders fall under inorganic chemicals chapter.

8485.90.10Higher: 38.1% vs 35%

If stationary semiconductor production tooling

Fixed tooling for semiconductor fabs classifies as machinery parts.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

High-tech goods require export control checks alongside HTS; declare cleanroom compatibility

Use advance rulings for wafer-specific applications to lock classification

Related Products under HTS 6804.21.00

Diamond Grinding Wheel for Steel Polishing

A high-precision grinding wheel made from agglomerated synthetic diamond abrasives, designed specifically for polishing and finishing steel surfaces in metalworking applications. It falls under HTS 6804.21.00 due to its composition of agglomerated synthetic diamond used for grinding and polishing without frameworks. These wheels provide superior durability and heat resistance compared to traditional abrasives.

Synthetic Diamond Dressing Wheel

An agglomerated synthetic diamond wheel used for dressing and truing other grinding wheels in precision machining setups. Classified under HTS 6804.21.00 for its diamond abrasive composition tailored for trueing operations. Essential in maintaining wheel geometry for high-tolerance manufacturing.

Agglomerated Diamond Cut-Off Wheel

Thin, resin-bonded wheel of agglomerated synthetic diamond designed for precision cutting of ceramics, glass, and composites. HTS 6804.21.00 applies to its diamond abrasive matrix for cutting operations without frameworks. Widely used in fabrication shops for clean, burr-free cuts.

Diamond Lapping Plate

Flat plate embedded with agglomerated natural diamond particles for ultra-fine lapping of precision optical and semiconductor components. Falls under HTS 6804.21.00 as an abrasive tool for polishing without other frameworks. Achieves mirror finishes on hard materials like sapphire and silicon.

Synthetic Diamond Honing Stone

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Diamond Deburring Wheel

Agglomerated synthetic diamond wheel optimized for removing burrs from machined metal edges post-CNC operations. Under HTS 6804.21.00 for its diamond abrasives used in finishing and trueing. Critical for quality control in precision manufacturing.