Precision Diamond Grinding Disc from Mexico
Ultra-thin disc of agglomerated natural diamond for grinding thin wafers in electronics production. HTS 6804.21.00 due to diamond composition for semiconductor polishing/cutting. Enables sub-micron flatness tolerances.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• High-tech goods require export control checks alongside HTS; declare cleanroom compatibility
• Use advance rulings for wafer-specific applications to lock classification