Precision Diamond Grinding Disc from Mexico
Ultra-thin disc of agglomerated natural diamond for grinding thin wafers in electronics production. HTS 6804.21.00 due to diamond composition for semiconductor polishing/cutting. Enables sub-micron flatness tolerances.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• High-tech goods require export control checks alongside HTS; declare cleanroom compatibility
• Use advance rulings for wafer-specific applications to lock classification