Precision Diamond Grinding Disc from Germany
Ultra-thin disc of agglomerated natural diamond for grinding thin wafers in electronics production. HTS 6804.21.00 due to diamond composition for semiconductor polishing/cutting. Enables sub-micron flatness tolerances.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• High-tech goods require export control checks alongside HTS; declare cleanroom compatibility
• Use advance rulings for wafer-specific applications to lock classification