Precision Diamond Grinding Disc from Japan
Ultra-thin disc of agglomerated natural diamond for grinding thin wafers in electronics production. HTS 6804.21.00 due to diamond composition for semiconductor polishing/cutting. Enables sub-micron flatness tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• High-tech goods require export control checks alongside HTS; declare cleanroom compatibility
• Use advance rulings for wafer-specific applications to lock classification