SiC 1200F Fine Powder for Wire Sawing
SiC 1200F grade fine powder optimized for slurry in diamond wire sawing of silicon wafers. HTS 2849.20.20.00 for pulverized silicon carbide, refined grain form. High friability for cutting applications.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If block form before fine grinding
Coarse block material grinds down to powder subheading 2849.20.20.
If mounted in saw wires
SiC embedded in cutting wires becomes tool under Chapter 82.
If dispersed in polishing slurries
Prepared as wet slurry with polishes classifies under Chapter 34.
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Import Tips & Compliance
• Semiconductor industry specs required; cleanroom packaging essential; slurry compatibility testing recommended
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