SiC 1200F Fine Powder for Wire Sawing from Japan
SiC 1200F grade fine powder optimized for slurry in diamond wire sawing of silicon wafers. HTS 2849.20.20.00 for pulverized silicon carbide, refined grain form. High friability for cutting applications.
Duty Rate — Japan → United States
0.5%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Semiconductor industry specs required; cleanroom packaging essential; slurry compatibility testing recommended