SiC 1200F Fine Powder for Wire Sawing from Germany
SiC 1200F grade fine powder optimized for slurry in diamond wire sawing of silicon wafers. HTS 2849.20.20.00 for pulverized silicon carbide, refined grain form. High friability for cutting applications.
Duty Rate — Germany → United States
0.5%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Semiconductor industry specs required; cleanroom packaging essential; slurry compatibility testing recommended