Wafer Dicing Saw Blades
Wafer dicing saw blades are diamond-impregnated blades specifically designed for cutting semiconductor wafers into individual chips. They achieve kerf widths under 50 microns, ensuring precise and clean cuts. These blades are critical parts for semiconductor device production and fall under parts of photosensitive semiconductor devices.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the blades are interchangeable tools for cutting, not specific to semiconductor wafers
Interchangeable tools for cutting are classified in heading 82.07.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify the blades as parts of semiconductor devices, not as tools of Chapter 82
• Provide specifications showing the blades are designed for wafer dicing
• Be aware that blades for general cutting may be classified under heading 82.07
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