Parts
Parts suitable for use solely or principally with the apparatus of heading 85.35, 85.36 or 85.37. > Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED): > Other > Parts > Parts
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8541.90
Diode Clipping Lead Formers
Diode clipping lead formers are specialized tooling dies used to bend and shape the axial leads of semiconductor diodes after packaging. They create precise bend radii that allow diodes to be mounted securely on printed circuit boards, making them dedicated parts for diode manufacturing and handling.
8541.90.00Diode Test Socket Assemblies
Diode test socket assemblies are precision fixtures used to hold semiconductor diodes during electrical testing and quality control. They feature electrical contacts that match diode pin configurations, ensuring reliable connections for performance verification. These are dedicated parts for diode testing and fall under parts of photosensitive semiconductor devices.
8541.90.00LED Driver Circuit Boards
LED driver circuit boards are printed circuit boards pre-assembled with components that regulate current and voltage for LED operation. They are designed to be integrated with LED arrays in lighting applications, providing the necessary power control. These boards are parts of light-emitting diodes and are classified under parts of photosensitive semiconductor devices.
8541.90.00LED Eutectic Bonding Fixtures
LED eutectic bonding fixtures are precision tools made of gold-tin alloy used to bond LED dies to substrates during manufacturing. They maintain uniform temperature at 280°C for reliable eutectic bonding, ensuring high-quality LED assembly. These fixtures are specialized parts for LED production and fall under parts of light-emitting diodes.
8541.90.00LED Phosphor Coating Applicators
LED phosphor coating applicators are precision dispensing nozzles used to apply phosphor coatings onto LED chips during manufacturing. They ensure uniform coating thickness for consistent light output and color quality. These applicators are specialized parts for LED production and are classified under parts of light-emitting diodes.
8541.90.00Photo Diode Lens Mounts
Photodiode lens mounts are precision holders designed to attach optical lenses directly onto photosensitive semiconductor diodes. They enhance light collection efficiency by ensuring proper lens alignment and focus. These mounts are dedicated parts for photodiodes and fall under parts of photosensitive semiconductor devices.
8541.90.00Photovoltaic Cell Frames
Photovoltaic cell frames are aluminum frames specifically designed to encase photovoltaic cells in solar modules. They provide structural support, sealing, and protection for the cells, ensuring durability in outdoor environments. These frames are parts of photosensitive semiconductor devices and are classified under parts of photovoltaic cells.
8541.90.00Piezoelectric Crystal Oscillators Housings
Piezoelectric crystal oscillator housings are metal enclosures designed to encase mounted piezoelectric crystals for frequency control. They provide hermetic sealing and vibration isolation, ensuring stable oscillator performance. These housings are parts of piezoelectric crystals and fall under parts of semiconductor devices.
8541.90.00Power Transistor Gate Drivers PCBs
Power transistor gate driver PCBs are printed circuit boards with high-speed driver circuits for controlling MOSFET and IGBT gates in power electronics. They handle switching frequencies up to 100kHz, ensuring efficient transistor operation. These boards are parts of semiconductor transistors and are classified under parts of semiconductor devices.
8541.90.00Semiconductor Lead Frames
Semiconductor lead frames are copper alloy frames used for wire bonding semiconductor dies during packaging. They provide the electrical connections between the die and external circuits, with precise lead patterns for chip attachment. These lead frames are essential parts for diodes, transistors, and integrated circuits, and fall under parts of semiconductor devices.
8541.90.00Semiconductor Wafer Trays
Semiconductor wafer trays are plastic trays designed for transporting and storing semiconductor wafers during manufacturing. They protect wafers from damage and contamination, ensuring process integrity. These trays are dedicated components for semiconductor handling and fall under parts of semiconductor devices.
8541.90.00Solar Cell Encapsulant Sheets
Solar cell encapsulant sheets are ethylene-vinyl acetate (EVA) sheets formulated to encapsulate photovoltaic cells in solar modules. They provide optical clarity, moisture resistance, and mechanical protection for the cells. These sheets are parts of photosensitive semiconductor devices and are classified under parts of photovoltaic cells.
8541.90.00Transistor Heat Sinks
Transistor heat sinks are aluminum components designed for mounting on power transistors to dissipate heat during operation. They prevent thermal damage and ensure reliable transistor performance. These heat sinks are parts of semiconductor devices and are classified under parts of transistors.
8541.90.00Transistor Mounting Brackets
Transistor mounting brackets are stamped steel brackets with hole patterns matching power transistor packages like TO-3 and TO-247. They enable secure mounting and heat transfer to the chassis. These brackets are dedicated parts for semiconductor transistors and fall under parts of semiconductor devices.
8541.90.00Wafer Dicing Saw Blades
Wafer dicing saw blades are diamond-impregnated blades specifically designed for cutting semiconductor wafers into individual chips. They achieve kerf widths under 50 microns, ensuring precise and clean cuts. These blades are critical parts for semiconductor device production and fall under parts of photosensitive semiconductor devices.