Semiconductor Lead Frames
Copper alloy lead frames used for wire bonding semiconductor dies during packaging, stamped with precise lead patterns for chip attachment. These are essential parts for diodes, transistors, and integrated circuits and fall under tariff item 8541.90.00 as parts of semiconductor devices.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the lead frames are in the form of unworked copper plates
Unworked copper plates are classified in heading 74.09, not as semiconductor parts.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Classify these lead frames as parts of semiconductor devices under 8541.90.00
• Ensure they are not classified as general copper articles
• Provide documentation showing their specific use in semiconductor packaging
Related Products under Tariff item 8541.90.00
50mm Extruded Aluminum PV Panel Frame
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Aluminum Solar Panel Frame 35mm
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Black Anodized Solar Cell Frame Kit
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Diode Clipping Lead Formers
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Diode Laser Mounting Bases
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