Wafer Dicing Saw Blades from Germany
Wafer dicing saw blades are diamond-impregnated blades specifically designed for cutting semiconductor wafers into individual chips. They achieve kerf widths under 50 microns, ensuring precise and clean cuts. These blades are critical parts for semiconductor device production and fall under parts of photosensitive semiconductor devices.
Duty Rate — Germany → Canada
0%
Import Tips
• Classify the blades as parts of semiconductor devices, not as tools of Chapter 82
• Provide specifications showing the blades are designed for wafer dicing
• Be aware that blades for general cutting may be classified under heading 82.07