Wafer Dicing Saw Blades from Germany
Diamond-impregnated blades specifically for cutting semiconductor wafers into individual chips or dice, with kerf width under 50 microns. These are critical parts for photosensitive semiconductor device production and fall under tariff item 8541.90.00.
Duty Rate — Germany → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Declare these blades as parts of semiconductor device production under 8541.90.00, not as general cutting tools
• Ensure they are specifically designed for wafer dicing
• Provide specifications on blade dimensions and diamond content