IGBT Silicon Die on Wafer
A 200mm silicon wafer containing unmounted insulated-gate bipolar transistor (IGBT) chips rated 1200V/200A, used in industrial motor drives and uninterruptible power supplies. The wafer is classified as an unmounted semiconductor device under tariff item 8541.59.00, as the individual dice have not yet been separated or packaged.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the dice are separated and packaged as individual transistors
Separated and packaged IGBTs fall under the specific subheading for transistors with a dissipation capacity of less than 1 W.
If the dice are separated and packaged as individual transistors with a dissipation capacity of 1 W or more
Higher-power packaged transistors are classified under this subheading for other transistors.
If the wafer is processed into a monolithic integrated circuit
Wafers containing integrated circuits rather than discrete semiconductor devices fall under heading 85.42.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the wafer is declared as an unmounted semiconductor device, not as a finished transistor, to avoid misclassification
• Provide a detailed product specification sheet to the CBSA officer if requested
• Verify whether the wafer qualifies for duty-free treatment under a free trade agreement applicable to your country of origin
Related Products under Tariff item 8541.59.00
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