Wafer Lapping Machine
A Wafer Lapping Machine is precision lapping equipment that achieves sub-micron flatness on semiconductor wafers by abrading with loose abrasive slurry on a rotating plate. This process involves grinding and mechanical action, which aligns with the functions described in tariff item 8479.82.00. It is essential for preparing wafers with the required surface quality for semiconductor fabrication.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is used solely or principally for semiconductor wafer manufacturing
Heading 84.86 covers machines for semiconductor manufacture, which is more specific than 8479.
If the machine is a general-purpose lapping machine for other materials
Other machine tools for finishing metals or cermets may fall under heading 84.60.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the lapping machine is classified under 8479.82.00 by providing evidence of its grinding and abrading functions
• Check if the equipment qualifies for duty-free treatment under certain trade agreements
• Prepare to provide technical specifications to the CBSA for verification
Related Products under Tariff item 8479.82.00
Chemical Powder Blender
A ribbon blender that homogeneously mixes dry chemical powders through helical ribbon agitation, ensuring consistent batch composition. This machine falls under tariff item 8479.82.00 as a mixing and homogenizing machine for industrial chemical processing.
Crystal Boule Grinder
A machine that grinds semiconductor crystal boules to precise diameters required for standard wafer production and etches flats for resistivity indication. This machine falls under tariff item 8479.82.00 as grinding apparatus for semiconductor processing.
Crystal Boule Melt Stirrer
A magnetic or mechanical stirrer for semiconductor melt crucibles, ensuring dopant uniformity during crystal growth and preventing striations in finished silicon ingots. This machine falls under tariff item 8479.82.00 as a stirring machine for semiconductor processing.
Crystal Orientation Grinder
A grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. This machine falls under tariff item 8479.82.00 as an essential wafer preparation step for semiconductor manufacturing.
Czochralski Crystal Puller
A Czochralski Crystal Puller is a specialized machine used in semiconductor manufacturing to grow monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon. It operates by heating and controlled mechanical lifting, which falls under the mixing, stirring, and related mechanical functions of tariff item 8479.82.00. This equipment is essential for producing high-purity silicon crystals used in electronic components.
Diamond Wafer Polishing System
A Diamond Wafer Polishing System is a chemical mechanical polishing (CMP) system using diamond abrasives to achieve a mirror finish on semiconductor wafers for device fabrication. It combines mechanical polishing with chemical slurries, falling under the grinding and polishing functions of tariff item 8479.82.00. This system is crucial for producing the ultra-smooth surfaces required in advanced microelectronics.