Other
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this Chapter. > Other machines and mechanical appliances: > Mixing, kneading, crushing, grinding, screening, sifting, homogenizing, emulsifying or stirring machines > Other
Duty Rate (from China)
Products classified under Tariff item 8479.82.00.90
Chemical Powder Blender
A ribbon blender that homogeneously mixes dry chemical powders through helical ribbon agitation, ensuring consistent batch composition. This machine falls under tariff item 8479.82.00 as a mixing and homogenizing machine for industrial chemical processing.
8479.82.00Crystal Boule Grinder
A machine that grinds semiconductor crystal boules to precise diameters required for standard wafer production and etches flats for resistivity indication. This machine falls under tariff item 8479.82.00 as grinding apparatus for semiconductor processing.
8479.82.00Crystal Boule Melt Stirrer
A magnetic or mechanical stirrer for semiconductor melt crucibles, ensuring dopant uniformity during crystal growth and preventing striations in finished silicon ingots. This machine falls under tariff item 8479.82.00 as a stirring machine for semiconductor processing.
8479.82.00Crystal Orientation Grinder
A grinding machine that precisely orients semiconductor crystal flats to crystallographic planes for device fabrication. This machine falls under tariff item 8479.82.00 as an essential wafer preparation step for semiconductor manufacturing.
8479.82.00Double-Sided Wafer Lapper
A simultaneous double-sided lapping machine for semiconductor wafers, achieving uniform thickness across the entire wafer surface. This machine falls under tariff item 8479.82.00 as specialized grinding and lapping equipment for semiconductor processing.
8479.82.00Epitaxial Gas Premix Kneader
A kneading machine for multi-component precursor gas mixtures used in epitaxial layer growth on semiconductor wafers, ensuring stoichiometric uniformity. This machine falls under tariff item 8479.82.00 as a kneading machine for semiconductor processing.
8479.82.00Gallium Arsenide Precursor Homogenizer
An emulsifying and stirring machine for gallium arsenide compound semiconductor precursors, ensuring molecular uniformity before MOCVD reactor introduction for wafer epitaxy. This machine falls under tariff item 8479.82.00 as a homogenizing machine for semiconductor processing.
8479.82.00Industrial Dough Kneader
A high-capacity spiral mixer that kneads large batches of dough for commercial bakery production through intensive mechanical working. This machine is classified under tariff item 8479.82.00 specifically for its kneading function, which is not covered elsewhere in Chapter 84.
8479.82.00Paint Emulsifying Mixer
A high-shear rotor-stator mixer that emulsifies pigments into water-based paints, creating stable dispersions. This machine falls under tariff item 8479.82.00 as an emulsifying machine used in paint and coating production.
8479.82.00Pharmaceutical Homogenizer
A high-pressure homogenizer that creates stable emulsions for pharmaceutical creams and suspensions by forcing product through narrow gaps at over 1000 bar. This machine falls under tariff item 8479.82.00 for its emulsifying function, which is essential to drug manufacturing.
8479.82.00Semiconductor Wafer Grinding Machine
A precision grinder that processes semiconductor wafers sliced from crystal boules, grinding to exact diameter and creating orientation flats indicating conductivity type. This machine qualifies under tariff item 8479.82.00 as grinding equipment for semiconductor processing.
8479.82.00Semiconductor Wafer Lapping Machine
A machine that laps semiconductor wafers to achieve precise flatness and thickness uniformity required for device fabrication. This machine falls under tariff item 8479.82.00 as specialized wafer preparation grinding equipment.
8479.82.00Semiconductor Wafer Slurry Mixer
A high-precision mixing machine for preparing diamond or silica slurry used in wafer slicing saws, ensuring uniform abrasive particle dispersion critical for thin kerf cuts in silicon wafers. This machine falls under tariff item 8479.82.00 as a mixing machine for semiconductor processing.
8479.82.00Wafer Edge Grinding Machine
A specialized grinder for creating precise chamfered edges on semiconductor wafers to prevent chipping during handling and processing. This machine falls under tariff item 8479.82.00 as a grinding machine for semiconductor wafer preparation.
8479.82.00Wafer Grinding Coolant Agitator
A continuous stirring machine for coolant reservoirs in wafer grinders and lappers, preventing abrasive settling during backgrinding to achieve sub-micron flatness. This machine falls under tariff item 8479.82.00 as a stirring machine for semiconductor wafer preparation.